Here’s FusionAP! This Malaysia-based company specializes in semiconductor packaging technologies. 

• Now, they’ve just raised a $2M pre-seed.

Investor check. Vertex Ventures Southeast Asia and India and Southern Capital Group led the round. 

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✅ The ABCs of FusionAP

Founded in 2025, FusionAP is developing a geopolitically neutral outsourced semiconductor assembly and test (OSAT) platform.  

• OSAT providers typically assemble semiconductor chips, package them, and perform quality testing. 
• Think of them as the back-end of the semiconductor supply chain. 

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Why neutral? They’re targeting global companies seeking to diversify their supply chains, as most OSAT companies are concentrated in East Asia, particularly Taiwan. 

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What they do. FusionAP works with Integrated Circuit designers and wafer fabrication companies to deliver 2.5D, 3D, and future-ready packaging solutions. 

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☀️ Some more detail

FusionAP is one of the founding members of the Malaysia Advanced Packaging Consortium, a group formed to support the local packaging ecosystem.

• Oh, and they’ve also been offered a matching research grant from the Malaysia Science Endowment under the Ministry of Science, Technology, and Innovation. 

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🧐 What’s with the $$$? 

Vertex Ventures said that the fresh funds will be used for engineering and process integration, R&D and intellectual property development, and pilot capacity.